Custom Connections

these services enable our customers to meet their electronic interconnect requirements

Each phase of the layout process logs any and all pertinent information is logged to assure that all requirements and changes are fully documented. Designs will be in accordance to IPC Design Guidelines or as specified by you, our customer.

01. Customer Package
02. Design Database Preparation
03. Schematic Capture
04. First Design Review
05. Placement
06. Second Design Review
07. Routing Process
08. Post Processing
09. Third Design Review
10. Design Verification
11. Archiving of Data
12. Design Change Process

01. CUSTOMER PACKAGE
• Netlist must be in ASCII format, adaptive to design software layout tools.
• Bill of Materials must contain information about components, their package type, quantity used, and manufacturer information.
• Schematic (hardcopy), or .pdf for all pages, B size (11" x 17") sheet size or larger.
• Mechanical drawing with PCB outline and all dimensions and specified tolerances. Keep-out areas and any special features, such as mounting holes, cutouts, and fiducials. Overall board thickness.
• Data sheets from manufacturers for all components, including recommended footprint.
• Special Considerations: General information about the design such as speed of logic, density and types of constraints, unique clock distribution schemes, impedance requirements, unusual or special electrical constraints, ICT test points requirements, design standards, and assembly constraints.
• Data input to Custom Connections:

Email: sales@customconnections.net
WEB Site: www.customconnections.net
Address:
Custom Connections, Inc.
P.O. Box 145
Meridian, ID 83680-0145
Phone: (208) 895-0494
FAX: (208) 895-0495

02. DESIGN DATABASE PREPARATION & DFM analysis
The customer’s netlist, bill of materials and mechanical information are combined to create a CAD database. PCB symbols (footprints) are created from Custom Connections libraries and customer-supplied data sheet. The complete data package is reviewed and a design plan formulated.

We incorporate a DFM analysis and may:

Suggest alternative design and fabrication techniques to meet customer cost requirements.

Techniques to increase routing densities to meet state-of-the-art, or ultra high density designs which incorporate the use of conventional or micro-via technologies can also be influenced.

We may propose the use of alternative construction materials, where appropriate, and be responsible to customers for answering critical design, fabrication, assembly or associated interconnect related questions.

03. Schematic Capture
Schematic capture and/or changes will be performed using leading CAE software.
Schematic compliance in specifying process methodologies will be important so as to ensure accuracy in layout process such as:

04. FIRST DESIGN REVIEW
Design review with customer to review all input. At this point in the design phase all assumptions will be disclosed.

05. PLACEMENT
Fixed items such as connectors are placed. Critical items are placed according to customer-supplied constraints. These items would include height-restricted components and components such as clock distribution networks requiring fixed distances between nodes.

Finally, the remaining placement is completed while factoring in various considerations such as routability, testability (ICT), electrical rules and assembly guidelines. The placement typically proceeds in a module-by-module basis, which causes initial components to be placed in small groups. These groups are then placed into larger and larger groups.

06. SECOND DESIGN REVIEW
Design review with customer to review all placement parameters.

07. ROUTING PROCESS
All net properties are assigned. Pin escapes (via fanouts) and critical nets are routed. Test routes are run in parallel to determine trouble areas and to refine the routing approach. All remaining routing is completed, again within the electrical testing and manufacturing rules. Power planes and plane cutouts are created.
Featuring Cooper and Chyans SPECCTRA Autorouter and PADs Blaze Route when autorouting is done.

08. POST PROCESSING
The creation of Gerber and drill data is accomplished. Fabrication and assembly drawings and data packages are generated according to customer requirements.

09. THIRD DESIGN REVIEW
Final design review with customer to review completed printed circuit board.

10. DESIGN VERIFICATION
The final manufacturing data (Gerber, drill, netlist, DRC rules, etc.) are loaded into CAM350, or other appropriate software. The checks performed include physical spacing violations, CAD netlist/Gerber data conflicts, drill size, and annular ring problems. Once verified, the final design files are compressed and sent to Fabricator of your choice, or one that we have selected for prototyping.

11. ARCHIVING OF DATA
Two (2) copies of the Design Data are archived onto CD-ROM. One will remain at Custom Connections, and the second will be stored off-site in a fire proof safe. At the Customer request, CCI will make an archive CD and mail or electronically transfer to their location.

12. CHANGE - DURING THE DESIGN PROCESS
We can minimize the impact of changes by doing the following:
• The change must be in writing: via fax, e-mail, or paper.
• Acknowledge that the change has been received by, and understood by Custom Connections engineers or technicians.
• CCI operations will feedback any schedule or cost impact to customer.
• Upon approval, CCI will incorporate the change.
• CCI will create, and customer will review to insure that the change has been properly implemented.